Built on flip-chip packaging, the COB holographic transparent screen features four core parts: 4-layer flexible hollow PCBs, 0517 large LED chips, high-transmittance weatherproof encapsulant and compact high-precision driver ICs. It cuts power use by 37.5%,surface temperature by 30%, dead pixel rate by 90%, slashes weight by 37.5%, while widening viewing angle by 21%. Eliminating fundamental flaws of traditional integrated LED transparent screens through optical optimization, it delivers hologram-style floatingvisuals with top-tier transparency and display quality
Product Features
1.Four-layer flexible perforated PCB with high-temperature resistant substrate, over 80% perforation rate. 3-oz thick copper layer reduces thermal resistance by 60%. Etching accuracy ±5μm, bendable for irregular curved surfaces, stable signal transmission with no ghosting.
2.Inverted COB LED chip (0517 large size): light-emitting area increased by over 300%,luminous efficiency ≥180lm/W, lower power consumption. 170° ultra-wide viewing angle,±2nm bin-level control for consistent color and brightness across the screen.
3.High-transparency optical encapsulant: light transmittance ≥95%, reduces light loss via refractive index matching, anti-glare matte/fog effect. Bonding strength >3 MPa，operating temperature -10°C to 60°C, UV yellowing rate ≤1%, eco-friendly.
4.Suspended visual optical design optimizes pixel arrangement and depth of field, achieving3D suspension without holographic film, preventing cross-lighting for clear images, and ensuring uniform brightness/color within 170° viewing angle (no color shift or attenuation).
5.Miniaturized 1.5*2.5mm LED driver IC ensures uniform LED emission via precise currentcontrol. Low-power design cuts energy consumption, with overheat/overcurrent protec
tions for exceptional stability
